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公开(公告)号：JP5470059B2
公开(公告)日：2014-04-16
申请号：JP2010007196
申请日：2010-01-15
Applicant: 日東電工株式会社
IPC: B29C65/16 , B23K26/082 , B23K26/18 , B23K26/32
CPC classification number: B29C65/168 , B29C65/1616 , B29C65/1619 , B29C65/1635 , B29C65/1641 , B29C65/1645 , B29C65/1654 , B29C65/1683 , B29C65/1687 , B29C65/4815 , B29C65/5042 , B29C66/1122 , B29C66/1142 , B29C66/41 , B29C66/43 , B29C66/45 , B29C66/71 , B29C66/723 , B29C66/7352 , B29C66/81267 , B29C66/81457 , B29C66/8322 , B29C66/9161 , B29C66/919 , B29C66/929 , B29C66/934 , B29C66/939 , B29K2069/00 , B29K2029/04 , B29K2023/12 , B29K2023/06 , B29K2067/003 , B29K2079/085 , B29K2001/12 , B29K2033/12 , B29K2023/38 , B29K2059/00 , B29K2071/00 , B29K2075/00 , B29K2025/06 , B29K2077/00 , B29K2067/006 , B29K2023/083 , B29K2027/06 , B29K2001/00 , B29K2023/18 , B29K2029/14 , B29K2067/00
Abstract: PROBLEM TO BE SOLVED: To provide a laser bonding method of a resin member that can carry out also well a bonding of resin members while increasing a utilization efficiency of an irradiating laser beam in carrying out a laser bonding of the resin members through an optical absorption agent. SOLUTION: The laser bonding method of the resin members 10a, 10b includes mounting two or more resin members 10a, 10b on a stage 31, contacting the resin members 10a, 10b through an optical absorption agent layer 20, depositing the resin members 10a, 10b by an irradiation of a laser beam 50 from a direction opposed to the stage 31 to the contact surface, and bonding the resin members 10a, 10b. In the laser bonding method of the resin members 10a, 10b, the stage 31 includes a laser beam reflecting member 30 having an optical reflectance of ≥70% to the laser beam 50. COPYRIGHT: (C)2011,JPO&INPIT
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公开(公告)号：JP5555613B2
公开(公告)日：2014-07-23
申请号：JP2010270428
申请日：2010-12-03
Applicant: 日東電工株式会社
IPC: B29C65/16
CPC classification number: B29C65/1635 , B29C65/1616 , B29C65/1619 , B29C65/168 , B29C65/1683 , B29C65/18 , B29C65/245 , B29C65/4815 , B29C65/5042 , B29C66/1122 , B29C66/1142 , B29C66/43 , B29C66/71 , B29C66/73115 , B29C66/73117 , B29C66/7352 , B29C66/81267 , B29C66/81457 , B29K2069/00 , B29K2029/04 , B29K2023/06 , B29K2023/12 , B29K2067/003 , B29K2027/06 , B29K2001/12 , B29K2033/12 , B29K2023/38 , B29K2059/00 , B29K2071/00 , B29K2079/085 , B29K2075/00 , B29K2025/06 , B29K2067/006 , B29K2023/083 , B29K2023/18 , B29K2077/00
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公开(公告)号：JP5608376B2
公开(公告)日：2014-10-15
申请号：JP2010005593
申请日：2010-01-14
Applicant: 日東電工株式会社
IPC: B29C65/16
CPC classification number: B29C65/5042 , B29C65/1616 , B29C65/1619 , B29C65/1635 , B29C65/1654 , B29C65/168 , B29C65/4815 , B29C66/1142 , B29C66/43 , B29C66/71 , B29C66/73521 , B29C66/81267 , B29C66/81457 , B29C66/8322 , B29K2001/12 , B29K2023/06 , B29K2023/083 , B29K2023/12 , B29K2023/18 , B29K2023/38 , B29K2025/06 , B29K2027/06 , B29K2029/04 , B29K2033/12 , B29K2059/00 , B29K2067/00 , B29K2067/003 , B29K2067/006 , B29K2069/00 , B29K2071/00 , B29K2075/00 , B29K2077/00 , B29K2079/085
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Patent Agency Ranking
公开(公告)号：JP5408971B2
公开(公告)日：2014-02-05
申请号：JP2008301133
申请日：2008-11-26
Applicant: 日東電工株式会社
CPC classification number: B29C66/1122 , B29C65/1612 , B29C65/1635 , B29C65/1658 , B29C65/1677 , B29C65/1683 , B29C66/41 , B29C66/71 , B29C66/73117 , B29C66/73921 , B29C66/73941 , B29C66/8122 , B29C66/81267 , B29C66/83435 , B29K2909/08 , B29K2079/085 , B29K2079/08
Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a sheet joint body for manufacturing a sheet joint body improved in joint quality. SOLUTION: The method of manufacturing the sheet joint body for manufacturing the sheet joint body with a resin sheet and a metal film welded and joined by laminating the resin sheet on the metal film to form a laminate and irradiating the laminate with laser beams from the back face side of the resin sheet, is characterized in that a support material with elasticity to have the amount of compressive strain of 0.1-20 μm at 5 MPa pressurization is allowed to abut on the back face side of the metal film and that irradiation of the laser beams is carried out in a state of pressurizing the resin sheet toward the metal film at a pressure of 1-100 kgf/cm 2 . COPYRIGHT: (C)2010,JPO&INPIT
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公开(公告)号：JP5608395B2
公开(公告)日：2014-10-15
申请号：JP2010058876
申请日：2010-03-16
Applicant: 日東電工株式会社
IPC: B29C65/16
CPC classification number: B29C65/1635 , B29C65/1616 , B29C65/1619 , B29C65/1658 , B29C65/168 , B29C65/4815 , B29C65/5042 , B29C66/1142 , B29C66/43 , B29C66/71 , B29C66/73161 , B29C66/7392 , B29C66/73921 , B29C66/7394 , B29C66/81267 , B29C66/81457 , B29C66/8322 , B29K2079/08 , B29K2075/02 , B29K2075/00 , B29K2069/00 , B29K2067/003 , B29K2063/00 , B29K2061/04 , B29K2059/00 , B29K2033/12 , B29K2029/04 , B29K2025/06 , B29K2023/38 , B29K2023/18 , B29K2023/00
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公开(公告)号：JP5548579B2
公开(公告)日：2014-07-16
申请号：JP2010232702
申请日：2010-10-15
Applicant: 日東電工株式会社
CPC classification number: B29C65/1635 , B29C65/1677 , B29C65/8223 , B29C66/1122 , B29C66/43 , B29C66/71 , B29C66/73921 , B29C66/81 , B29C66/81267 , B29C66/8322 , B29C66/836 , B29C66/9161 , B29C66/919 , B29K2995/0027 , B29L2011/00 , B29K2029/04
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公开(公告)号：JP5408972B2
公开(公告)日：2014-02-05
申请号：JP2008301198
申请日：2008-11-26
Applicant: 日東電工株式会社
IPC: B29C65/16
CPC classification number: B29C66/1122 , B29C65/1612 , B29C65/1635 , B29C65/1658 , B29C65/1677 , B29C65/1683 , B29C66/43 , B29C66/71 , B29C66/73921 , B29C66/73941 , B29C66/8122 , B29C66/81267 , B29C66/83411 , B29C66/83417 , B29C66/83431 , B29C66/83435 , B29C66/9241 , B29C66/929 , B29K2909/08 , B29K2001/12 , B29K2023/06 , B29K2023/12 , B29K2023/38 , B29K2025/06 , B29K2029/04 , B29K2033/12 , B29K2067/00 , B29K2067/003 , B29K2069/00 , B29K2075/00 , B29K2079/085
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