Invention Patent
- Patent Title: Printed circuit board laminate and manufacturing method thereof
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Application No.: JP2009269293Application Date: 2009-11-26
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Publication No.: JP5601828B2Publication Date: 2014-10-08
- Inventor: 秀紀 後藤
- Applicant: 住友電装株式会社
- Assignee: 住友電装株式会社
- Current Assignee: 住友電装株式会社
- Priority: JP2009269293 2009-11-26
- Main IPC: H05K1/14
- IPC: H05K1/14 ; H05K3/36
Public/Granted literature
- JP2011114158A Printed-wiring board laminate and method of manufacturing the same Public/Granted day:2011-06-09
Information query
