以质量％计的Bi：31〜59％，锑：0.15〜0.75％，进一步的Cu：0.3〜1.0％和/或P：含0.002至0.055％，无铅焊料合金，余量基本上由锡的 具有在焊接过程中能够在薄基板的失真抑制的低熔点。 再次焊料合金是使用焊接到电极具有包含P的Ni被覆，P-富含层的生长被抑制的钎焊接合部的剪切强度得到改善的情况。 此外，钎料合金具有高的延展性和合金的拉伸强度，因此能够形成可靠的焊接接头。

By mass%, Bi: 31~59%, Sb: 0.15~0.75%, further Cu: 0.3 to 1.0% and / or P: containing .002 to .055%, lead-free solder alloy and the balance being essentially of Sn has a low melting point capable of distortion suppression of the thin substrate during soldering. Again solder alloy is a case of using the soldering to electrodes having a Ni coating containing P, growth of P-rich layer is suppressed shear strength of the solder joints is improved. Also, the solder alloy has high ductility and tensile strength of the alloy, it is possible to form a reliable solder joints.