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发明授权
KR101722704B1 주석-은 솔더 범프 고속 도금액 및 이를 이용한 도금 방법 有权
锡银焊料凸块的高速电镀液及使用该电镀液的方法

주석-은 솔더 범프 고속 도금액 및 이를 이용한 도금 방법
摘要：
본발명은고속도금조건하에서주석-은솔더범프고속도금액으로, 주석이온 2.1 ~ 20wt%; 은이온 0.01 ~ 1.5wt%; 전도염 5.0 ~ 30wt%; N,N'-디이소프로필티오우레아, 디페닐티오우레아, 디메틸티오우레아, 디에틸티오우레아, 티오우레아디옥사이드로이루어진그룹에서일이상선택되는우레아화합물 0.12 ~ 15wt%; 결정립조정제 0.3 ~ 10wt%; 평활제 0.8 ~ 8wt% 및잔량의초순수를포함하여이루어지는주석-은솔더범프고속도금액에관한것이다.또한, 본발명은상기주석-은솔더범프고속도금액을반도체장치등 전자부품의기판상에접촉시키고 3.0 ~ 20 A/dm의전류밀도를인가하고, 도금속도 1.5 ~ 10 μm/min로도금하고, 주석-은솔더범프내 은의함량이 1.0 ~ 4.0wt% 인것을특징으로하는주석-은솔더범프고속도금방법을제공한다.본발명에따른주석-은솔더범프고속도금액및 이를이용한고속도금방법은고속도금조건에서안정적인도금속도와범프은 함량을가져, 매끄러운도금표면, 균일한범프간의크기를원활하게형성할수 있는이점이있다.
摘要（中）：

本发明涉及在高速金条件下锡 - 银焊料块高速充电，2.1至20wt％锡离子; 0.01至1.5重量％的银离子; 导盐5.0〜30wt％; N，N'-二异丙基硫脲，硫脲二苯基，二甲基硫脲，二乙基硫脲，选自二氧化硫脲的组中选择0.12〜15重量％的尿素的至少一种化合物; 晶粒尺寸调节剂0.3〜10重量％ 它涉及eunsol多个凸点高速量的本发明是一种锡 - 均化剂0.8〜8重量％的锡，其包括超纯水是低的。接触的电子部件的基板上的eunsol多个凸点高速量如半导体器件 施加3.0〜20，电流密度安培/分米，电镀速度为1.5〜10微米/分钟为禁止，锡 - 锡eunsol，其特征在于，银的凸块内的内容1.0〜4.0wt％的多 - eunsol更高速金凸块 提供了根据本发明的方法评价。eunsol多个凸点高速值，并使用相同的高速金法将被带到一个稳定均匀的金属辅助beompeueun在高速金条件内容，顺利形成光滑表面电镀均匀的凸块之间的尺寸 有这一点。

摘要（英）：

The invention tin under high speed conditions, the gold-silver solder bump as high-speed plating solutions, tin ion 2.1 ~ 20wt%; Ion 0.01 ~ 1.5wt%; Conductive salt 5.0 ~ 30wt%; N, N'- di-isopropyl-thiourea, diphenyl thiourea, dimethyl thiourea, diethyl thiourea, 0.12 ~ 15wt% urea least one compound selected from the group consisting of thiourea dioxide; Grain controlling agent 0.3 ~ 10wt%; Tin comprises a smoothing of the ultra-pure water 0.8 ~ 8wt% and a residual amount-relates to a solder bump high speed plating.
The present invention is a tin-silver solder bump high speed plating the semiconductor device or the like in contact with the image of the electronic part substrate and applying a current density of 3.0 ~ 20 A / dm 2, and is plated with the plating rate is 1.5 ~ 10 μm / min , tin-silver tin, characterized in that the content of silver in the solder bump of 1.0 ~ 4.0wt% - provides a solder bump high speed plating method.
Tin according to the invention are high-speed plating method using a high speed plating solution and this, the solder bump is the advantage of being able to get a stable coating rate and bumps content in a high-speed plating conditions, smoothly form a size between smooth plating surface, uniform bumps is.

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