The present invention, it is possible to improve the problem of the separation that occurs on the substrate, such as Cu and the metal wiring, such as Al, electrode, substrate, in particular SiN, using a 2.38% TMAH aqueous solution to be used universally in the developing solution, the pattern to provide a bottom, scum and footing the positive photosensitive resin composition capable of forming a fine pattern in the form of a taper in order without producing on a substrate an object.
The above object is, (A) to have a repeating unit represented by the general formula (1), a polymer compound having a siloxane chain having a weight average molecular weight of 3,000~500,000, (B) generating an acid by light and in an alkaline aqueous solution is achieved with the photosensitive material that the dissolution rate increases, (C) a crosslinking agent, and (D) the positive photosensitive resin composition containing a solvent.