复合布线基板包括：第一布线基板，其具有用于接收电子部件的开口，并且在上表面上分别包括多个第一连接焊盘和多个第二连接焊盘; 以及第二布线基板，其具有安装在下表面上的电子部件，所述第二布线基板包括通过在下表面的外周侧中的焊接而接合到所述第一连接焊盘的第三连接焊盘，并且布置在所述第一布线基板上以覆盖 开幕。 用于接地的内壁导体层通过围绕电子部件而沉积在开口的内壁上，并且用于接地的导体层沉积在通过内壁导体层中的焊接连接的第二布线基板的下表面上。

And having an opening for receiving the electronic components as well as a first circuit board having a plurality of second connection pads in the plurality of first connection pads on the upper surface and lower respectively, and; The when having a third connection pads joined by a solder to said first connection pads on the outer peripheral side of the lower box and, at the same time, mount the electronic component on, disposed so as to cover the opening on the first circuit board 2 a composite wiring substrate formed by comprising a circuit board, the inner wall of the conductor layer for the ground in the inner wall of the openings is deposited by surrounding the electronic components that and, at the same time, the solder on the lower face of the second circuit board on the inner wall of the conductive layer a has a conductor layer for a ground connected through.