利索-全球专利检索

  1. Login
  2. Sign Up
Invention Publication
KR1020160120496A 실장 기판 모듈 审中-实审
安装模块

  • Patent Title: 실장 기판 모듈
  • Patent Title (English): Mounting module
  • Patent Title (中): 安装模块
  • Application No.: KR1020150049615
    Application Date: 2015-04-08
  • Publication No.: KR1020160120496A
    Publication Date: 2016-10-18
  • Inventor: 김민훈 , 진세민 , 장재현
  • Applicant: 삼성전기주식회사
  • Applicant Address: Maeyoung-Ro *** (Maetan-Dong), Youngtong-Gu, Suwon-Si, Gyeonggi-Do, Republic of Korea
  • Assignee: 삼성전기주식회사
  • Current Assignee: 삼성전기주식회사
  • Current Assignee Address: Maeyoung-Ro *** (Maetan-Dong), Youngtong-Gu, Suwon-Si, Gyeonggi-Do, Republic of Korea
  • Agent 특허법인씨엔에스
  • Main IPC: H05K1/02
  • IPC: H05K1/02 ;  H01L23/13
실장 기판 모듈
Abstract:
본발명의일 실시예에따른실장기판모듈은, 기판; 기판의일면에실장되는회로부; 및기판의타면에실장되어회로부에전원을공급하는전원공급부; 를포함하고, 기판은전기적으로그라운드(GND)인접지층을포함함으로써, 실장된전자소자에미치는노이즈와같은부정적인영향을줄일수 있다.
Abstract(Chinese):

安装板模块包括板; 设置在所述板的第一侧上的电路单元; 以及电源单元，其布置在所述电路板的与所述电路单元相对的第二侧，并且被配置为向所述电路单元供电，其中所述电路板包括设置在所述电路单元和所述电源单元之间的接地层，其中所述接地层被配置 电接地。

Abstract(English):

A mounting board module according to an exemplary embodiment of the present invention, a substrate; Circuit to be mounted on a surface of a substrate; And it is mounted on the other surface of the substrate power supply for supplying power to the circuitry; And including, the substrate can reduce the electrical ground (GND) by including a ground layer, negative effects such as noise on the mounted electronic element.

Information query
Espacenet
Patent Agency Ranking
0/0