A photosensitive resin composition for projection exposure on a substrate, with the aim of providing a method for forming a resist pattern that has a good resist shape, can reduce the occurrence of resist cuts, and can form a resist pattern with improved adhesion and aspect ratio. A process of forming a photosensitive resin layer by using, a process of exposing the photosensitive resin layer through a lens using an active light projecting an image of a photomask, and an unexposed portion of the photosensitive resin layer on a substrate. The photosensitive resin composition for projection exposure contains (A) a binder polymer, (B) a photopolymerizable compound having an ethylenically unsaturated bond, and (C) a photopolymerization initiator. A method for forming a resist pattern in which the light transmittance of the resin layer at a wavelength of 365 nm is 58.0% or more and 95.0% or less is provided.