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发明授权
KR102435883B1 소자 리페어 장치 有权

  • 专利标题： 소자 리페어 장치
  • 专利标题（英）： APPARATUS FOR REPAIRING DEVICE
  • 申请号： KR1020200110491
    申请日： 2020-08-31
  • 公开(公告)号： KR102435883B1
    公开(公告)日： 2022-08-25
  • 主分类号： H05K13/04
  • IPC分类号： H05K13/04 ;  H05K3/34 ;  H05K1/11
소자 리페어 장치
摘要：
본발명의일실시예는신규소자의파손이방지되도록하고, 안전한리페어공정이수행될수 있도록하는소자리페어장치를제공한다. 여기서, 소자리페어장치는접속소재전사용스탬프그리고소자전사용스탬프를포함한다. 접속소재전사용스탬프는기판상에서소자가전사되지않은리페어영역에신규접속소재를전사한다. 소자전사용스탬프는신규접속소재에신규소자를전사한다. 소자전사용스탬프는, 가압력이가해지면굽힘변형되어신규소자의파손한계하중보다작은제로강성(Zero Stiffness) 하중이신규소자에가해지도록하는소자용하중제어부를가진다.
摘要（英）：

One embodiment of the present invention provides an element repair apparatus that prevents damage to a new element and enables a safe repair process to be performed. Here, the element repair apparatus comprises: a stamp for transferring a connection material; and a stamp for transferring an element. The stamp for transferring a connection material transfers a new connection material to a repair area on a substrate to which the element has not been transferred. The stamp for transferring an element transfers a new element to the new connection material. The stamp for transferring an element has a load control unit for an element that is bent and transformed when a pressing force is applied so that a zero stiffness load smaller than a failure limit load of the new element is applied to the new element.

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