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KR102471934B1 표면 처리된 금속 분말 및 도전성 조성물 有权

  • 专利标题： 표면 처리된 금속 분말 및 도전성 조성물
  • 专利标题（英）： SURFACE-TREATED METAL POWDER AND CONDUCTIVE COMPOSITION
  • 申请号： KR1020217023883
    申请日： 2019-11-08
  • 公开(公告)号： KR102471934B1
    公开(公告)日： 2022-11-30
  • 优先权： JPJP-P-2019-003897 2019-01-11
  • 国际申请： PCT/JP2019/043954 2019-11-08
  • 国际公布： WO2020144931 2020-07-16
  • 主分类号： B22F1/00
  • IPC分类号： B22F1/00 ;  C23C22/52 ;  H01B1/02 ;  H01B1/22 ;  H01B5/14
표면 처리된 금속 분말 및 도전성 조성물
摘要：
금속분말의소결지연성을높이는데 유용한보다범용적인기술을제안한다. Si, Ti, Al 또는 Zr을함유하는커플링제의 1종이상으로표면처리된금속분말이며, Si, Ti, Al 및 Zr의합계부착량이당해표면처리된금속분말 1g에대하여 200∼10000μg이며, 상기커플링제는 1질량% 농도의수용액으로했을때의 pH가 7 이하이고, 소결개시온도가 500℃이상인, 표면처리된금속분말.
摘要（英）：

There is provided a more versatile technique that is useful for enhancing the sintering delay property of a metal powder. A metal powder surface-treated with at least one coupling agent comprising Si, Ti, Al or Zr, wherein a total adhesion amount of Si, Ti, Al and Zr is 200 to 10,000 µg with respect to 1 g of the surface-treated metal powder, wherein a 1% by mass aqueous solution of the coupling agent indicates a pH of 7 or less, and wherein a sintering starting temperature is 500 °C or higher.

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