在一种半导体设备中,将一半导体组件建构于一以平板状所成型之树脂成型部内。使一布线电性连接至该半导体组件及配置在该树脂成型部之一表面上,以便以该树脂成型部密封该布线之内表面侧及暴露该布线之外表面以与该树脂成型部之一表面齐平。使一电极配置在该半导体组件之一平面区域的外侧之该布在线及在厚度方向上延伸穿过该树脂成型部。该电极之顶部从该树脂成型部之另一表面突出。

In a semiconductor device, a semiconductor element is built into a resin molded part molded in a flat plate shape. A wiring is electrically connected to the semiconductor element and is disposed on one surface of the resin molded part so that an inner surface side of the wiring is sealed with the resin molded part and an outer surface of the wiring is exposed flush with the one surface of the resin molded part. An electrode is disposed on the wiring in an outside of a plane area of the semiconductor element and extends through the resin molded part in a thickness direction. A tip part of the electrode protrudes from the other surface of the resin molded part.