一种模块化之多晶粒封装结构,包括:复数个晶粒,每一晶粒具有一主动面且主动面上配置体复数个焊垫;一封装体,系环覆于每一晶粒之五个面且曝露出每一晶粒之主动面及每一焊垫;复数个图案化之金属线段,部份图案化之金属线段之两端电性连接复数个晶粒之主动面上的复数个焊垫,而部份图案化之金属线段之一端电性连接复数个晶粒之主动面上之复数个焊垫;一图案化之保护层,系覆盖复数个图案化之金属线段并曝露部份图案化之金属线段之另一端;复数个导电组件,系将复数个导电组件电性连接在已曝露之每一图案化之金属线段之另一端上;及一散热设备,系形成于封装体之一背面上。

A multichip package structure is provided, which includes a plurality of chips, each chips have a plurality of pads on an active surface thereon; a package body is covered around the five sides of the chips and the active surface and the pads of the chip is to be exposed; a plurality of patterned metal traces, the two ends of the portion of the patterned metal traces are electrically connected to the plurality of pads of the chips, one end of the other portion of the metal traces is electrically connected to the pads of the chips; a patterned protective layer is covered on the patterned metal traces and another end of the patterned metal traces is to be exposed; a plurality of conductive elements is electrically connected to one end of the exposed portion of the patterned metal traces; and a heat sink is provided on the backside of the package body.