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Invention Patent
TW200924585A 電路板、半導體裝置及製造半導體裝置的方法 CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开
电路板、半导体设备及制造半导体设备的方法 CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

電路板、半導體裝置及製造半導體裝置的方法 CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Abstract:
本發明提供一種一由一無鉛(Pb)焊料構成之焊料球欲與之連接的電路板、一包括一電極及一由一無鉛(Pb)焊料構成且設置在該電極上之焊料球的半導體裝置、及一製造該半導體裝置的方法,其中安裝可靠性可藉加强在由一無鉛(Pb)焊料構成之焊料球與該電極間之結合强度(黏著强度)而改善。
Abstract(Chinese):

本发明提供一种一由一无铅(Pb)焊料构成之焊料球欲与之连接的电路板、一包括一电极及一由一无铅(Pb)焊料构成且设置在该电极上之焊料球的半导体设备、及一制造该半导体设备的方法,其中安装可靠性可藉加强在由一无铅(Pb)焊料构成之焊料球与该电极间之结合强度(黏着强度)而改善。

Abstract(English):

There is provided a circuit board to which a solder ball composed of a lead (Pb)-free solder is to be connected, a semiconductor device including an electrode and a solder ball composed of a lead (Pb)-free solder disposed on the electrode, and a method of manufacturing the semiconductor device, in which mounting reliability can be improved by enhancing the bonding strength (adhesion strength) between the solder ball composed of a lead (Pb)-free solder and the electrode.

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