一种接合板以及利用接合板的接合方法。此接合板适于与待接合物接合。此接合板包括承载板、第一黏着层以及第二黏着层。第一黏着层配置于承载板上。第二黏着层配置于第一黏着层上，用以与待接合物接合。承载板与第一黏着层之间的黏着力大于第一黏着层与第二黏着层之间的黏着力，且第一黏着层与第二黏着层之间的黏着力大于第二黏着层与待接合物之间的黏着力。

A bonding plate and a bonding method using the same are provided. The bonding plate is suitable for bonding to the subject to be bonded. The bonding plate includes a carrier, a first adhesion layer and a second adhesion layer. The first adhesion layer is disposed on the carrier. The second adhesion layer is disposed on the first adhesion layer for bonding to the subject to be bonded. The adhesion between the carrier and the first adhesion layer is more than the adhesion between the first adhesion layer and the second adhesion layer. The adhesion between the first adhesion layer and the second adhesion layer is more than the adhesion between the second adhesion layer and the subject to be bonded.