本发明提供一种切晶黏晶膜，其即便于工件为薄型时，对工件进行切晶时之保持力与将由切晶所得之芯片状工件及其黏晶膜成一体地剥离时之剥离性的平衡特性亦优异。本发明之切晶黏晶膜之特征在于：于基材上具有包含黏着剂层之切晶膜与设置于该黏着剂层上之黏晶膜，上述黏着剂层含有聚合物，该聚合物系含有作为主要单体之丙烯酸酯、相对于丙烯酸酯而含量为10~30 mol%之范围内之含羟基之单体、相对于含羟基之单体而含量为70~90 mol%之范围内之具有自由基反应性碳-碳双键的异氰酸酯化合物而构成，且上述黏晶膜系含有环氧树脂而构成。

Disclosed is a dicing die-bonding film which has an excellent balance between a holding force during the dicing of a work and detachability upon the detachment of a chip-type work produced by the dicing together with the die-bonding film even when the work is thin. The dicing die-bonding film comprises a base material, a dicing film arranged on the base material and having an adhesive layer, and a die-bonding film arranged on the adhesive layer, wherein the adhesive layer comprises a polymer comprising an acrylic acid ester as the main monomer, a hydroxyl-containing monomer at a content of 10 to 30 mol% relative to the amount of the acrylic acid ester, and an isocyanate compound having a radical-reactive carbon-carbon double bond at a content of 70 to 90 mol% relative to the amount of the hydroxyl-containing monomer, and wherein the die-bonding film comprises an epoxy resin.