揭示一种电磁干扰屏蔽层连接至接地信号之导线架型半导体封装构造，包含导线架、芯片、封胶体以及电磁干扰屏蔽层。封胶体系具有两引脚外露侧面以及两无引脚侧面。电磁干扰屏蔽层系包覆该封胶体之至少一表面以及无引脚侧面。导线架之芯片承座之金属支撑条具有一外露于无引脚侧面之端面，电磁干扰屏蔽层覆盖连接在无引脚侧面之金属支撑条外露端面，使导线架之芯片承座之金属支撑条与接地引脚经封胶体外部相连接，使芯片承座具有接地电位。

Disclosed is a leadframe-type semiconductor package having EMI shielding layer connected to ground signal, comprising a leadframe, a chip, an encapsulant and the EMI shielding layer. The encapsulant has two lead-disposed sides and two leadless sides. The EMI shielding layer covers at least one surface of the encapsulant and the leadless sides. A metal tie bar connecting die pad of the leadframe has a cut end exposed from one of the leadless sides. Since the covering of the EMI shielding layer to connect the cut end of metal tie bar on the leadless side, the die pad and its metal tie bar of the leadframe are connected with the ground lead through outer electrical connection from the encapsulant to allow the die pad to be ground potential.