提供用于堆栈式半导体内存封装之系统及方法。每一封装可包括一集成电路(“IC”)封装基板，该IC封装基板能够经由两个信道将数据传输至堆栈在该封装内之多个内存晶粒。每一信道可位于该IC封装基板之一侧上，且来自每一信道之信号可自该等内存晶粒之各别侧投送至该等内存晶粒。

Systems and methods are provided for stacked semiconductor memory packages. Each package can include an integrated circuit (''IC'') package substrate capable of transmitting data to memory dies stacked within the package over two channels. Each channel can be located on one side of the IC package substrate, and signals from each channel can be routed to the memory dies from their respective sides.