本发明提供一种屏蔽形状之设计自由度较高且可以确保配线层与屏蔽间之电性连接的电路模块及其制造方法。本发明之一实施形态的电路模块(100)，系具备：配线基板(2)、复数个电子组件(3)、封装层(4)、导电性屏蔽(5)及导体层(10)。封装层(4)系被覆复数个电子组件(3)，由绝缘性材料所构成，且具有沿着第1区域(2A)与第2区域(2B)之边界所形成的沟槽部(41)。导电性屏蔽(5)系具有：被覆封装层(4)之外表面的第1屏蔽部(51)；以及设置于沟槽部(41)的第2屏蔽部(52)。导体层(10)系具有：设置于安装面(2a)且将端子面(2b)和第2屏蔽部(52)电性连接的配线部(11)；以及设置于配线部(11)且将配线部(11)之与第2屏蔽部(52)的连接区域予以局部加厚的加厚部(12)。

Disclosed is a circuit module and the manufacturing method there of, wherein there is more freedom of designing the shield shape of the circuit module, and it is able to ensure an electrical connection between a wiring layer and the shield. A circuit module (100) according to one embodiment the present invention, comprises a wiring substrate (2), a plurality of electric components (3), an encapsulating layer (4), a conductive shield (5), and a conductive layer (10). The encapsulating layer (4) covers a plurality of electric components (3), made of an insulated material, and has a groove (41) formed along the boundary of a first area (2A) and a second area (2B). The conductive shield (5) comprises: a first shield part (51) covering the outside surface of the encapsulating layer (4); and a second shield part (52) mounted at the groove (41). The conductive layer (10) comprises: a wiring part (11) mounted at an installing side (2a) and electrically connecting a terminal side (2b) and the second shield part (52) together; and a thickening part (12) mounted at the wiring part (11) and locally thickening the part connecting with the second shield part (52) of the wiring part (11).