本发明之无铅焊料合金，系可抑制在高电流密度的通电中的电迁移及电阻增大之焊料接点之无铅焊料合金，其以质量%，具有In：1.0-13.0%、Ag：0.1-4.0%、Cu：0.3-1.0%及残部为Sn所组成之合金组成。该焊料合金，于超过100℃的高温，显示优良的拉伸特性，不仅CPU，亦可使用于功率半导体等。

A lead-free solder alloy capable of forming solder joints in which electromigration and an increase in resistance during electric conduction at a high current density are suppressed has an alloy composition consisting essentially of 1.0-13.0 mass % of In, 0.1-4.0 mass % of Ag, 0.3-1.0 mass % of Cu, a remainder of Sn. The solder alloy has excellent tensile properties even at a high temperature exceeding 100 DEG C. and can be used not only for CPUs but also for power semiconductors.