本文描述用于改良晶圆涂布之烘焙方法及工具。在一个实施例中，切割包括集成电路之半导体晶圆之方法涉及涂布半导体晶圆之表面以形成覆盖集成电路之遮罩。该方法涉及利用来自一或更多个光源之辐射烘焙遮罩。该方法涉及利用激光划割制程图案化遮罩，以向图案化遮罩提供间隙，从而曝露基板的介于集成电路之间的区域。该方法亦可涉及诸如利用等离子蚀刻操作来单体化集成电路。

Baking methods and tools for improved wafer coating are described. In one embodiment, a method of dicing a semiconductor wafer including integrated circuits involves coating a surface of the semiconductor wafer to form a mask covering the integrated circuits. The method involves baking the mask with radiation from one or more light sources. The method involves patterning the mask with a laser scribing process to provide a patterned mask with gaps, exposing regions of the substrate between the ICs. The method may also involves singulating the ICs, such as with a plasma etching operation.