本发明之揭示系有关制造微电子封装之领域，其中在被沉积在一第一基材上的一介电层中形成腔穴，以维持各被焊接的互连间之分离。在一实施例中，该等腔穴可具有倾斜侧壁。在另一实施例中，可在该等腔穴中沉积一焊料膏，且可在加热之后形成焊料结构。在其他实施例中，可将该等焊料结构放置在该等腔穴中，或可在该第一基材可被连接到的一第二基材上形成该等焊料结构。在另外的其他实施例中，可在该第一基材及第二基材上形成焊料结构。可使该等焊料结构接触到且回焊到第二基材上之接触垫或焊料结构，而将该等焊料结构用来形成焊料互连。

The present disclosure relates to the field of fabricating microelectronic packages, wherein cavities are formed in a dielectric layer deposited on a first substrate to maintain separation between soldered interconnections. In one embodiment, the cavities may have sloped sidewalls. In another embodiment, a solder paste may be deposited in the cavities and upon heating solder structures may be formed. In other embodiments, the solder structures may be placed in the cavities or may be formed on a second substrate to which the first substrate may be connected. In still other embodiments, solder structures may be formed on both the first substrate and a second substrate. The solder structures may be used to form solder interconnects by contact and reflow with either contact lands or solder structures on a second substrate.