本发明提供一种功率模块及其热界面结构，热界面结构包括：基体；及多个填料颗粒，分布在基体内；其中，当填料颗粒受压力时，至少部分填料颗粒发生变形，相邻的至少两个填料颗粒至少部分相互接触，从而形成用于传递热量的导热通路。本发明的热界面结构通过采用具有变形能力的填料颗粒，在压力的作用下可以创建其高导热的填料颗粒之间的充分接触，使得相邻填料颗粒的接触面积增大，由此增加热界面结构的热导率，形成用于利于热量快速有效传递的导热通路，实现了填料颗粒含量与粘度、工艺性之间的平衡。

The present disclosure provides a power module and a thermal interface structure thereof. The thermal interface structure includes a substrate and a plurality of filler particles. The filler particles are distributed in the substrate. When the pressure is applied on the filler particles, the filler particles are at least partially deformed, the at least two adjacent filler particles of the filler particles are at least partially contacted with each other, thereby a thermal conduction path used for transferring heats is formed. In the thermal interface structure of the present disclosure, by utilizing filler particles with transforming function, the filler particles are sufficiently contacted with adjacent one while being applied by a pressure, the contact areas of the adjacent filler particles are increased, such that the thermal conductivity of the thermal interface structure is enhanced, and a quick and effective thermal conduction path is established for transferring heats. Therefore, the balance of the amount of the filler particles, the viscosity of the filler particles, and the manufacturability is implemented.