本发明之框构件系用于借由包含密封材料之密封层密封光半导体组件之框构件。框构件包含：第1框部，其系以形成第1空间之方式构成；第2框部，其系以隔开间隔而于与第1框部之间形成第2空间之方式配置于第1框部之外侧，且以包围第1框部之方式配置；及链接部，其链接第1框部与上述第2框部。于第1空间配置有密封层及光半导体组件。第2空间接收来自密封光半导体组件之密封层之过剩之密封材料。

A frame member encapsulates an optical semiconductor device by using an encapsulation layer formed by an encapsulation material. The frame member comprises: a first frame unit which forms a first space; a second frame unit which includes intervals positioned at the outside of the first frame unit, forms a second space between the second frame unit and the first frame unit, and surrounds the first frame unit; and a connection unit which connects the first frame unit and the second frame unit. The encapsulation layer and the optical semiconductor device are arranged in the first space. The second space receives the surplus encapsulation material from the encapsulation layer encapsulating the optical semiconductor device.