一半导体设备，包含一基板具有一第一表面； 一半导体组件位于该第一表面上；以及一黏结结构位于该第一表面与该半导体组件之间，与该半导体组件以及该基板直接接触；其中，该黏结结构包含一黏结层以及一牺牲层，该黏结层与该牺牲层的材质相异。

A semiconductor device comprises a substrate having a first surface; a semiconductor unit on the first surface; and a adhesion structure between the first surface and the semiconductor unit and directly contacting the semiconductor unit and the substrate; wherein the adhesion structure comprises an adhesion layer and a sacrificing layer. and the materials of the adhesion layer and the sacrificing layer are different.