一种封装载板，包括一可挠性基板、一第一增层结构及一第二增层结构。可挠性基板具有相对的一第一表面及一第二表面，且具有连接于第一表面与第二表面之间的一第一开口。第一增层结构配置于第一表面且覆盖第一开口。第二增层结构配置于第二表面且具有一第二开口，第一开口与第二开口相连接而共同构成一芯片容置槽。此外，所述封装载板的制造方法及具有所述封装载板的芯片封装结构亦被提及。

A package carrier including a flexible substrate, a first build-up structure and a second build-up structure is provided. The flexible substrate has a first surface and a second surface opposite to each other, and has a first opening connected between the first surface and the second surface. The first build-up structure is disposed on the first surface and covers the first opening. The second build-up structure is disposed on the second surface and has a second opening, and the first opening and the second opening are connected to each other to form a chip accommodating cavity together. In addition, a manufacturing method of the package carrier and a chip package structure having the package carrier are also provided.