一发光组件包含一半导体叠层具有一第一半导体层，一第二半导体层，以及一活性层位于第一半导体层及第二半导体层之间；一第一焊垫与第一半导体层电连接；一第二焊垫与第二半导体层电连接；以及一金属层位于半导体叠层上，其中金属层环绕第二焊垫之复数个侧壁，金属层与第二焊垫相隔一间距。

A light-emitting device comprises a semiconductor stack comprising a first semiconductor layer, a second semiconductor layer, and an active layer between the first semiconductor layer and the second semiconductor layer; a first bonding pad electrically connected to the first semiconductor layer; a second bonding pad electrically connected to the second semiconductor layer; and a metal layer formed on the semiconductor stack, wherein the metal layer surrounds multiple sidewalls of the second bonding pad, the metal layer is separated from the second bonding pad by a distance.