一种芯片埋入式电路板结构包含多层板及埋置于多层板内的功率模块。功率模块包括绝缘基材、被绝缘基材包覆的功率单元、及设置于绝缘基材表面的线路层。所述功率单元包括有电热传导座以及多个功率芯片，电热传导座包含有传导部及垂直地相连于传导部的承载部，而每个功率芯片具有位于相反侧的第一电极层与第二电极层，上述多个第一电极层固定且并联地电性连接于承载部，并且所述多个功率芯片位于传导部的一侧。线路层电性连接于所述电热传导座与多个所述功率芯片的第二电极层，以使功率模块能通过线路层与电热传导座而测试每个功率芯片。

A manufacturing method of circuit board structure with chip embedded therein includes a multi-layer board and at least one power module embedded in the multi-layer board. The power module includes an insulating material, a power unit covered by the insulating material, and a circuit layer formed on a surface of the insulating material. The power unit includes an electrically and thermally conductive carrier and a plurality of power chips. The electrically and thermally conductive carrier has a transmitting portion and a carrying portion perpendicularly connected to the transmitting portion. Each power chip has a first electrode layer and a second electrode layer respectively arranged on two opposite sides thereof. The first electrode layers are fixed on the carrying portion, and are electrically connected to the carrying portion in parallel. The power chips are arranged at one side of the transmitting portion. The circuit layer is electrically connected to the electrically and thermally conductive carriers and the second electrode layers of the power chips, such that the power module can be used to test each power chip via the circuit layer and the electrically and thermally conductive carrier.