本发明提供电路设备之制造方法，其系有效率地制造以绝缘性树脂覆盖且一体支撑复数个电路组件所形成的电路设备(系统封装(SIP)或系统集成封装(ISB)) 其中，用户终端机10与ISB服务器12及ISB安装工厂14系以通信网络相连接。从用户终端机10输入用户所希望的 ISB电路设备必须满足的条件，例如ISB的外形尺寸或端子信息电路图电脑辅助设计(CAD)数据等，并将其发送至ISB服务器12。ISB服务器12系将该ISB电路设备之交货日期或费用、信赖性评价结果发送至用户终端机10。再者，按照所输入的条件作成用以制造ISB电路设备之遮罩数据，并将其发送至ISB安装工厂14。ISB安装工厂14系接收来自ISB服务器12之制造数据、制造ISB电路设备以提供给用户。

Provided is a method of making circuit device capable of effectively producing a circuit device such as SIP or ISB wherein a plurality of circuit elements are integrally covered and supported by an insulative resin. In the circuit device of the present invention, an user's terminal 10, an ISB server 12 and an ISB mounting site 14 are connected by a communication network. The conditions that an ISB circuit device meeting an user's expectation should satisfy, for example, the outline size of ISB, terminal information, CAD data of circuit drawing, is transmitted from the user's terminal 10 to the ISB server 12. In addition to the delivery time or expenses of the ISB circuit device, the ISB server 12 also transmits the reliability evaluation result to the user's terminal 10. Besides, a mask data for making ISB circuit data is formed according to the received conditions and sent to the ISB mounting site 14. In the ISB mounting site 14, a manufacturing data coming from the ISB server 12 is received, and the ISB circuit device is produced and provided to users.