Invention Grant
- Patent Title: Fan cover with plurality of openings
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Application No.: US14802125Application Date: 2015-07-17
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Publication No.: US10001140B2Publication Date: 2018-06-19
- Inventor: Fu-Yi Chen
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, LP.
- Current Assignee: Hewlett-Packard Development Company, LP.
- Current Assignee Address: US TX Houston
- Agency: HP Inc. Patent Department
- Main IPC: F04D29/58
- IPC: F04D29/58

Abstract:
Example implementations relate to a fan cover with a plurality of openings. For example, a device may include a fan cover to a fan device and a heat conduction device, a portion of the heat conduction device being coupled to an inside surface of the fan cover. The fan cover provides airflow for heat dissipation in a computing device and surrounds at least a portion of the fan device. The fan device has a first side associated with an axis about which an impeller of the fan device is capable of rotating and a second side associated with blade edges of the impeller of the fan device. The fan cover includes a flat portion to surround the first side and a curved portion to surround the second side, the curved portion having a plurality of openings such that airflow produced by the fan device is capable of passing through.
Public/Granted literature
- US20170016456A1 FAN COVER WITH PLURALITY OF OPENINGS Public/Granted day:2017-01-19
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