Invention Grant
- Patent Title: Integrated microneedle array delivery system
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Application No.: US14350156Application Date: 2012-10-09
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Publication No.: US10010707B2Publication Date: 2018-07-03
- Inventor: David J. Colburn , Erik J. Johnson , David H. Brandwein , Jerome E. Gysbers , Patrick J. Young , Adam S. Cantor
- Applicant: 3M INNOVATIVE PROPERTIES COMPANY
- Applicant Address: US MN St. Paul
- Assignee: 3M Innovative Properties Company
- Current Assignee: 3M Innovative Properties Company
- Current Assignee Address: US MN St. Paul
- International Application: PCT/US2012/059273 WO 20121009
- International Announcement: WO2013/055638 WO 20130418
- Main IPC: A61M37/00
- IPC: A61M37/00

Abstract:
The present disclosure provides a low-profile system and methods for delivering a microneedle array. The delivery system includes a housing that may be secured to and temporarily worn on a patient's skin. A carrier assembly coupled to a microneedle array is received in the housing proximate an applicator device. The carrier assembly is at least releasably secured to the housing and it is typically not attached or otherwise fixed to any portion of the applicator device.
Public/Granted literature
- US20140257187A1 INTEGRATED MICRONEEDLE ARRAY DELIVERY SYSTEM Public/Granted day:2014-09-11
Information query
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