A system for monitoring a component is provided. The system may include a strain sensor configured on the component, an electrical field scanner for analyzing the strain sensor, and a processor in operable communication with the electrical field scanner. The processor may be operable for measuring an electrical field value across the strain sensor along a mutually-orthogonal X-axis and Y-axis to obtain a data point set. The processor may further be operable for assembling a field profile of the strain sensor based on the data point set. Methods of using the system are also provided.