Invention Grant
- Patent Title: Semiconductor device having strained fin structure and method of making the same
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Application No.: US14825165Application Date: 2015-08-12
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Publication No.: US10014227B2Publication Date: 2018-07-03
- Inventor: Teng-Chun Tsai , Chun-Yuan Wu , Chih-Chien Liu , Chin-Cheng Chien , Chin-Fu Lin
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L21/84 ; H01L29/165 ; H01L21/8238 ; H01L27/12 ; H01L29/10

Abstract:
A semiconductor device includes a semiconductor substrate, at least a first fin structure, at least a second fin structure, a first gate, a second gate, a first source/drain region and a second source/drain region. The semiconductor substrate has at least a first active region to dispose the first fin structure and at least a second active region to dispose the second fin structure. The first/second fin structure partially overlapped by the first/second gate has a first/second stress, and the first stress and the second stress are different from each other. The first/second source/drain region is disposed in the first/second fin structure at two sides of the first/second gate.
Public/Granted literature
- US20150348971A1 SEMICONDUCTOR DEVICE HAVING STRAINED FIN STRUCTURE AND METHOD OF MAKING THE SAME Public/Granted day:2015-12-03
Information query
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