An imide resin composition including a terminal-modified imide oligomer of General Formula (1) and a thermoplastic aromatic polyimide of General Formula (2). (In Formula (1), either R1 or R2 shows a phenyl group and the other shows a hydrogen atom; R3 and R4 show a divalent residue of aromatic diamine; R5 and R6 show a tetravalent residue of aromatic tetracarboxylic acid; m and n satisfy relationships of m≥1, n≥0, 1≤m+n≤20, and 0.05≤m/(m+n)≤1; and an arrangement of repeating units may be either a block or random.) (In Formula (2), R1 and R2 show a divalent residue of aromatic diamine; R3 shows a tetravalent residue of aromatic tetracarboxylic acid; m and n satisfy relationships of m≥1 and n≥0, and an arrangement of repeating units may be either a block or random).