Invention Grant
- Patent Title: Solid-state image pickup device and electronic apparatus
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Application No.: US14087430Application Date: 2013-11-22
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Publication No.: US10020347B2Publication Date: 2018-07-10
- Inventor: Osamu Enoki , Toru Udaka , Masaki Murata , Rui Morimoto
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Chip Law Group
- Priority: JP2012-267867 20121207
- Main IPC: H04N5/369
- IPC: H04N5/369 ; H01L27/30 ; H01L51/44 ; H04N5/225 ; H01L51/00

Abstract:
Image sensors, electronic apparatuses, and methods of manufacturing an image sensor are provided. More particularly, an image sensor having a plurality of photoelectric conversion elements included in a laminated body is provided. At least one of the photoelectric conversion elements includes organic photoelectric conversion elements. In addition, at least a first surface of the laminated body includes a curved light incident surface, which further includes a concave surface. The plurality of photoelectric conversion elements receive light through the concave light incident surface. The laminated body can be connected to a support structure.
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