Invention Grant
- Patent Title: Method for connecting to external devices and electronic device implementing the same
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Application No.: US15513536Application Date: 2015-10-12
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Publication No.: US10028318B2Publication Date: 2018-07-17
- Inventor: Anki Cho , Jaewook Lee , Taieui Song
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2014-0137834 20141013
- International Application: PCT/KR2015/010742 WO 20151012
- International Announcement: WO2016/060424 WO 20160421
- Main IPC: H04B5/00
- IPC: H04B5/00 ; H04W76/10 ; H04W76/02 ; H04W4/00 ; H04W4/80 ; H04W84/12
Abstract:
According to various embodiments of the present invention, a method for connecting to external devices by using a near-field communication module in an electronic device may include: obtaining external device information for connecting to the external devices, connecting to the external devices by using the obtained external device information, and controlling the connected external devices.
Public/Granted literature
- US20170311359A1 METHOD FOR CONNECTING TO EXTERNAL DEVICES AND ELECTRONIC DEVICE IMPLEMENTING THE SAME Public/Granted day:2017-10-26
Information query
