Invention Grant
- Patent Title: Suspension board with circuit and producing method thereof
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Application No.: US15373573Application Date: 2016-12-09
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Publication No.: US10028378B2Publication Date: 2018-07-17
- Inventor: Hiroyuki Tanabe , Naohiro Terada , Yuu Sugimoto , Daisuke Yamauchi
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Edwards Neils, LLC
- Agent Jean C. Edwards, Esq.
- Priority: JP2015-242585 20151211
- Main IPC: H05K1/05
- IPC: H05K1/05 ; H05K1/11 ; H05K1/18 ; G11B5/48 ; H05K3/40 ; H05K3/44 ; H05K1/02 ; H05K1/03

Abstract:
A suspension board with circuit includes a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, and a conductor layer disposed at one side in the thickness direction of the base insulating layer and including a connecting terminal electrically connected to a slider. The base insulating layer has a terminal region, when projected in the thickness direction, overlapped with at least the connecting terminal and a circumferential region not overlapped with the terminal region and around the terminal region, and the thickness of the terminal region is thicker than that of the circumferential region.
Public/Granted literature
- US20170171969A1 SUSPENSION BOARD WITH CIRCUIT AND PRODUCING METHOD THEREOF Public/Granted day:2017-06-15
Information query