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公开(公告)号：US10558121B2
公开(公告)日：2020-02-11
申请号：US15605259
申请日：2017-05-25
Applicant: NITTO DENKO CORPORATION
Inventor： Yuu Sugimoto , Hiroyuki Tanabe , Yoshito Fujimura
Abstract: In a method for producing a wired circuit board includes a step (1), in which the insulating layer having an inclination face is provided; a step (2), in which a metal thin film is provided on the surface of the insulating layer including the inclination face; a step (3), in which a photoresist is provided on the surface of the metal thin film; a step (4), in which a photomask is disposed so that a first light exposure portion and a second light exposure portion in the photoresist are exposed to light, and the photoresist is exposed to light; a step (5), in which the first light exposure portion and the second light exposure portion are removed; and a step (6), in which the first wire and the second wire are provided on the surface of the metal thin film.
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公开(公告)号：US10257926B2
公开(公告)日：2019-04-09
申请号：US15463538
申请日：2017-03-20
Applicant: NITTO DENKO CORPORATION
Inventor： Yuu Sugimoto , Yoshito Fujimura , Hiroyuki Tanabe
Abstract: A method of producing a wired circuit board including an insulating layer and a conductive pattern, including: (1), an insulating layer having an inclination face, (2), a metal thin film provided at least on the inclination face, (3), a photoresist provided on the surface of the metal thin film, (4), a light shield portion of a photomask disposed so that a first portion, where the conductive pattern is to be provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask, (5), the first portion of the photoresist is removed to expose the metal thin film corresponding to the first portion, and (6), the conductive pattern is provided on the surface of the metal thin film exposed from the photoresist.
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公开(公告)号：US09949370B2
公开(公告)日：2018-04-17
申请号：US15373583
申请日：2016-12-09
Applicant: NITTO DENKO CORPORATION
Inventor： Hiroyuki Tanabe , Naohiro Terada , Yuu Sugimoto , Daisuke Yamauchi
CPC classification number: H05K1/05 , G11B5/483 , G11B5/4853 , H05K1/117 , H05K3/22 , H05K3/3442 , H05K3/4608 , H05K3/4644 , H05K2201/10151 , H05K2201/10227 , Y02P70/613
Abstract: A suspension board with circuit includes a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, a conductor layer disposed at the one side of the base insulating layer and including a connecting terminal electrically connected to a slider, a cover insulating layer covering the conductor layer to expose the connecting terminal and disposed at the one side of the base insulating layer, and a plating layer covering the connecting terminal. The cover insulating layer includes a first cover insulating layer disposed at the one side of the base insulating layer and a second cover insulating layer disposed at the one side of the first cover insulating layer, and the thickness of the plating layer is not more than the total sum of the thickness of the first cover insulating layer and that of the second cover insulating layer.
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公开(公告)号：US09502058B2
公开(公告)日：2016-11-22
申请号：US14878319
申请日：2015-10-08
Applicant: NITTO DENKO CORPORATION
Inventor： Yoshito Fujimura , Hiroyuki Tanabe , Saori Kanezaki , Naohiro Terada , Yuu Sugimoto
IPC: G11B5/48
CPC classification number: G11B5/4853 , G11B5/4826 , G11B5/484
Abstract: A suspension board with circuit includes a metal supporting layer, an insulating base layer on one side thereof in a thickness direction, a conductive pattern disposed on the insulating base layer, an insulating cover layer disposed on the insulating base layer so as to cover the conductive pattern, and a pedestal for supporting a slider which includes a thin pedestal portion. The thin pedestal portion includes a pedestal base layer included in the insulating base layer, a pedestal conductive layer included in the conductive pattern which extends over the pedestal base layer, and a pedestal cover layer included in the insulating cover layer and disposed on the pedestal conductive layer. The conductive pattern includes a first wire placed to extend over the insulating base layer which has a narrower portion, and a dimension of the pedestal conductive layer is 0.5 to 3 times the dimension of the narrower portion.
Abstract translation: 具有电路的悬挂板包括金属支撑层，在其一个厚度方向上的绝缘基底层，设置在绝缘基底层上的导电图案，设置在绝缘基底层上以覆盖导电性的绝缘覆盖层 图案，以及用于支撑包括薄基座部分的滑块的基座。 薄基座部分包括基底绝缘层中包括的基座基层，包括在基座基层上的导电图案中的基座导电层，以及包括在绝缘覆盖层中并设置在基座导电 层。 导电图案包括放置成在具有较窄部分的绝缘基底层上延伸的第一线，并且基座导电层的尺寸为较窄部分的尺寸的0.5至3倍。
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公开(公告)号：US10808329B2
公开(公告)日：2020-10-20
申请号：US16479071
申请日：2018-01-22
Applicant: NITTO DENKO CORPORATION
Inventor： Yuu Sugimoto , Hiroyuki Tanabe
IPC: H05K1/05 , G11B5/48 , C25D5/02 , C25D7/00 , C25D3/48 , C25D5/50 , H05K3/24 , C25D5/10 , C25D5/36 , H05K3/18 , H05K3/46 , H05K1/03 , H05K1/11 , H05K1/02
Abstract: The wired circuit board includes a metal supporting board, an insulating layer and a conductor layer disposed at one side in the thickness direction of the metal supporting board, a gold plate layer disposed at the other side in the thickness direction of the metal supporting board, and an adherence layer disposed between the metal supporting board and the gold plate layer. The material of the metal supporting board is a corrosion resistant alloy. In the adherence layer, gold and the metal contained in the corrosion resistant alloy are mixedly present.
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Patent Agency Ranking
公开(公告)号：US10687427B2
公开(公告)日：2020-06-16
申请号：US15478711
申请日：2017-04-04
Applicant: NITTO DENKO CORPORATION
Inventor： Yuu Sugimoto , Hiroyuki Tanabe , Yoshito Fujimura
Abstract: A method for producing a wired circuit board including an insulating layer and a conductive pattern, including (1), providing the insulating layer having an inclination face; (2), providing a metal thin film at least on the surface of the insulating layer; (3), providing a photoresist on the surface of the metal thin film; (4), disposing a photomask so that a first portion, where the conductive pattern is provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask; (5), removing the first portion to expose the metal thin film corresponding to the first portion; and (6), providing the conductive pattern on the surface of the metal thin film exposed from the photoresist. The inclination face has a second portion that allows the light reflected at the metal thin film to reach the first portion.
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公开(公告)号：US10251263B2
公开(公告)日：2019-04-02
申请号：US15712613
申请日：2017-09-22
Applicant: NITTO DENKO CORPORATION
Inventor： Yuu Sugimoto , Yoshito Fujimura , Hiroyuki Tanabe
Abstract: A method of producing a wired circuit board including an insulating layer and a conductive pattern, including: (1), an insulating layer having an inclination face, (2), a metal thin film provided at least on the inclination face, (3), a photoresist provided on the surface of the metal thin film, (4), a light shield portion of a photomask disposed so that a first portion, where the conductive pattern is to be provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask, (5), the first portion of the photoresist is removed to expose the metal thin film corresponding to the first portion, and (6), the conductive pattern is provided on the surface of the metal thin film exposed from the photoresist.
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8.发明授权公开(公告)号：US10121503B2
公开(公告)日：2018-11-06
申请号：US15689695
申请日：2017-08-29
Applicant: NITTO DENKO CORPORATION
Inventor： Yuu Sugimoto , Hiroyuki Tanabe
IPC: G11B5/48 , H05K1/05 , H05K3/00 , H05K3/06 , H05K3/40 , H05K1/11 , H05K1/18 , G11B5/00 , G11B5/31 , H05K3/34
Abstract: A suspension board with circuit having an opening with an electronic element inserted therein includes an insulating layer disposed at the edge of the opening, a first terminal disposed at one surface of the insulating layer and connected to a magnetic head, and a second terminal disposed at the other surface thereof and connected to the electronic element. The insulating layer includes a first portion in which the first terminal is disposed and a second portion that extends from the first portion toward the opening and is overlapped with a slider. The second portion is thinner than the first portion and is overlapped with the second terminal. The slider has a first surface facing the second portion. The first surface is disposed between the first terminal and the second terminal.
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公开(公告)号：US09992868B2
公开(公告)日：2018-06-05
申请号：US15305188
申请日：2015-03-20
Applicant: NITTO DENKO CORPORATION
Inventor： Yuu Sugimoto
CPC classification number: H05K1/05 , G11B5/484 , G11B5/4853 , G11B5/4873 , H05K1/056 , H05K1/113
Abstract: A wired circuit board includes a metal pedestal portion formed from a metal material that is the same as the material of the metal supporting board at the pad portion, a pedestal opening formed by opening the metal pedestal portion, a lower conductive layer disposed on one side in the thickness direction of the metal pedestal portion as the first conductive layer, and an upper conductive layer as the second conductive layer formed on one side in the thickness direction of the lower conductive layer as the first conductive layer, wherein one of the lower conductive layer as the first conductive layer and the upper conductive layer as the second conductive layer is disposed in the pedestal opening when projected in the thickness direction, and the periphery of the other is disposed outside of the pedestal opening when projected in the thickness direction.
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公开(公告)号：US09865287B2
公开(公告)日：2018-01-09
申请号：US15059850
申请日：2016-03-03
Applicant: NITTO DENKO CORPORATION
Inventor： Hiroyuki Tanabe , Yuu Sugimoto , Yoshito Fujimura
CPC classification number: G11B5/4833 , G11B5/484 , G11B5/4853 , H05K1/056 , H05K1/184
Abstract: A suspension board with circuit includes a first layer made of a metal supporting board, a second layer having insulating properties and provided at one side in a thickness direction of the first layer, and a third layer provided at one side in the thickness direction of the second layer and made of copper or a copper alloy. The first layer includes a first opening portion passing through in the thickness direction. The first opening portion is provided with a conductor layer that is, when projected in a direction orthogonal to the thickness direction, overlapped with the first layer. The conductor layer includes a first conductor circuit having a first electronic component-connecting terminal for being electrically connected to a first electronic component and made of copper or a copper alloy. The third layer includes a second conductor circuit having a second electronic component-connecting terminal for being electrically connected to a second electronic component.
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