Invention Grant
- Patent Title: Molded printhead
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Application No.: US14770608Application Date: 2013-09-27
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Publication No.: US10029467B2Publication Date: 2018-07-24
- Inventor: Silam J. Choy , Michael W. Cumbie , Devin Alexander Mourey , Chien-Hua Chen
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: HP Inc. Patent Department
- Priority: WOPCT/US2013/028216 20130228; WOPCT/US2013/046065 20130617
- International Application: PCT/US2013/062221 WO 20130927
- International Announcement: WO2014/133590 WO 20140904
- Main IPC: B41J2/16
- IPC: B41J2/16 ; B41J2/14

Abstract:
In one example, a printhead includes: a printhead die having a front face along which fluid may be dispensed from the die, the die molded into a monolithic molding having a channel therein through which fluid may pass directly to a back part of the die, the front face of the die exposed outside the molding and the back part of the die covered by the molding except at the channel; an electrical contact exposed outside the molding to connect to circuitry external to the printhead; a printed circuit board molded into the molding, the printed circuit board having an exposed front face co-planar with and surrounding the exposed front face of the die and a conductor electrically connected to the contact; and an electrical connection between the die and the printed circuit board conductor fully encapsulated in the molding.
Public/Granted literature
- US20160009086A1 MOLDED PRINTHEAD Public/Granted day:2016-01-14
Information query
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