- Patent Title: Pressure-sensitive adhesive microcapsule, pressure-sensitive adhesive microcapsule-containing liquid, gluing sheet and method for manufacturing same, and method for manufacturing laminate
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Application No.: US15214681Application Date: 2016-07-20
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Publication No.: US10030173B2Publication Date: 2018-07-24
- Inventor: Takahiro Nakazawa , Satoshi Tanaka , Yoshihito Hodosawa , Masaki Noro , Daisaku Abiru , Naoki Nakamura , Masashi Yamauchi
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2014-027197 20140217
- Main IPC: C09J7/38
- IPC: C09J7/38 ; B32B37/10 ; B32B37/12 ; C09J7/02 ; C09J109/00 ; C09J175/04 ; C09J175/16 ; C09J201/00 ; C08G18/70

Abstract:
In a pressure-sensitive adhesive microcapsule, a radiation-curable gluing agent is encapsulated by a wall film, and the average particle diameter is smaller than 500 μm. A pressure-sensitive adhesive microcapsule-containing liquid includes the pressure-sensitive adhesive microcapsule and a binder. A gluing sheet includes a layer including the pressure-sensitive adhesive microcapsule on a support. A method for manufacturing the gluing sheet includes forming a layer including a pressure-sensitive adhesive microcapsule on a support by applying the pressure-sensitive adhesive microcapsule-containing liquid onto the support and then carrying out radiation irradiation. A method for manufacturing a laminate includes gluing the gluing sheet and an adherend by bringing a surface of the layer including the pressure-sensitive adhesive microcapsule in the gluing sheet and the adherend into contact with each other and compressing them together.
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