Invention Grant
- Patent Title: Timestamp repair mechanism in case of decompression failure
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Application No.: US14864685Application Date: 2015-09-24
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Publication No.: US10037240B2Publication Date: 2018-07-31
- Inventor: Dominique Francois Bressanelli , Saket Bathwal , Deepak Sah
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: Qualcomm Incorporated
- Current Assignee: Qualcomm Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Holland & Hart LLP/Qualcomm
- Main IPC: G06F11/07
- IPC: G06F11/07 ; H04W8/30 ; H04L29/06 ; H04W28/06

Abstract:
Methods, systems, and devices may implement a header repair mechanism to deal with a loss of successive compressed headers (e.g., due to radio interface). The present methods and apparatus exploit the fact that once a correct timestamp (TS) from a previous decompression success (called “last successfully decomp_TS”) is known, another (e.g., a subsequent) TS should be in the form: last successfully decomp_TS+n*min_TS_STRIDE, where n is a positive integer if the estimated sequence number (SN) is higher than the last successfully decompressed SN, and a negative integer if the estimated SN is lower than the last successfully decompressed SN, and min_TS_STRIDE is the expected minimum TS increment, which is known and directly related to the medium sample rate and frame rate, for example.
Public/Granted literature
- US20170091014A1 TIMESTAMP REPAIR MECHANISM IN CASE OF DECOMPRESSION FAILURE Public/Granted day:2017-03-30
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