- 专利标题： Removable sacrificial connections for semiconductor devices
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申请号： US15357465申请日： 2016-11-21
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公开(公告)号： US10037925B2公开(公告)日： 2018-07-31
- 发明人: Alexandre Christian Volatier , Guillermo Moreno Granado
- 申请人： Qorvo US, Inc.
- 申请人地址： US NC Greensboro
- 专利权人： Qorvo US, Inc.
- 当前专利权人： Qorvo US, Inc.
- 当前专利权人地址： US NC Greensboro
- 代理机构： Withrow & Terranova, P.L.L.C.
- 主分类号： H01L21/66
- IPC分类号： H01L21/66 ; H01L23/00 ; H01L23/544 ; H01L21/78
摘要：
Methods of fabricating semiconductor devices and Radio Frequency (RF) components are provided. The method includes providing a circuit layout on a semiconductor layer and providing one or more sacrificial connections to connect bump pads in the circuit layout. The method also includes testing the circuit layout using the one or more sacrificial connections and removing at least a portion of the one or more sacrificial connections. In this way, the performance of the semiconductor device is improved by reducing or avoiding capacitive or inductive leakage paths that can be caused by leftover materials.
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