Invention Grant
- Patent Title: Forming a housing assembly
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Application No.: US15172114Application Date: 2016-06-02
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Publication No.: US10040245B2Publication Date: 2018-08-07
- Inventor: Mark David Senatori
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: HPI Patent Department
- Main IPC: B29C65/00
- IPC: B29C65/00 ; B29C65/54 ; G06F1/16 ; H05K5/03 ; B29K705/00 ; B29K709/08 ; B29L31/34

Abstract:
In some examples, a method of forming a housing assembly comprises affixing a support frame onto a first panel cover of the housing assembly, wherein the support frame includes an integrated pattern of channel cavities, positioning a second panel cover of the housing assembly adjacent the support frame, and flowing a bonding material through a plurality of openings of the second panel cover and into the channel cavities of the integrated pattern of the support frame so as to form a secure bond between the first panel cover, the support frame, and the second panel cover of the housing assembly.
Public/Granted literature
- US20160279864A1 FORMING A HOUSING ASSEMBLY Public/Granted day:2016-09-29
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