Invention Grant
- Patent Title: Wide array printhead module
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Application No.: US15518306Application Date: 2014-10-28
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Publication No.: US10046562B2Publication Date: 2018-08-14
- Inventor: Peter James Fricke , Michael W Cumbie , Scott A Linn
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Houston
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Houston
- Agency: HP Inc. Patent Department
- International Application: PCT/US2014/062722 WO 20141028
- International Announcement: WO2016/068888 WO 20160506
- Main IPC: B41J29/38
- IPC: B41J29/38 ; B41J2/15 ; B41J2/045

Abstract:
A wide array printhead module includes a plurality of printhead die, each of the printhead die includes a number of nozzles. The nozzles form a number of primitives. A nozzle firing heater is coupled to each of the nozzles. An application specific integrated circuit (ASIC) controls a number of activation pluses that activate the nozzle firing heaters for each of the nozzles associated with the primitives. The activation pulses are delayed between each of the primitives via internal delays and external delays to reduce peak power demands of the printhead die. The ASIC determines the internal delays within each printhead die.
Public/Granted literature
- US20170313059A1 WIDE ARRAY PRINTHEAD MODULE Public/Granted day:2017-11-02
Information query
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