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公开(公告)号:US11958293B2
公开(公告)日:2024-04-16
申请号:US17303656
申请日:2021-06-03
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Galen Cook , Garrett E Clark , Michael W Cumbie , James R Przybyla , Richard Seaver , Frank D Derryberry , Si-lam J Choy
CPC classification number: B41J2/145 , B41J2/14 , B41J2002/14459 , B41J2202/12 , B41J2202/20
Abstract: In some examples, a fluid ejection die includes a plurality of nozzles arranged in a plurality of nozzle columns, the plurality of nozzle columns distributed across a width of the fluid ejection die in a staggered manner, wherein nozzles of each respective nozzle column of the plurality of nozzle columns are spaced apart along a length of the fluid ejection die, wherein the plurality of nozzle columns includes a first pair of neighboring nozzle columns that are spaced by a first distance across the width. The plurality of nozzle columns includes a second pair of neighboring nozzle columns that are spaced by a second distance across the width, the second distance being larger than the first distance.
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公开(公告)号:US11642885B2
公开(公告)日:2023-05-09
申请号:US16916520
申请日:2020-06-30
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Michael W Cumbie , Chien-Hua Chen
CPC classification number: B41J2/14145 , B41J2/1404 , B41J2/14032 , B41J2/1601 , B41J2202/12
Abstract: A fluid ejection die includes an ejection nozzle and an ejection chamber fluidly connected to the ejection nozzle. The die includes a fluid input hole fluidly connected to the ejection chamber, a fluid output hole, and a fluid output channel fluidly connected to the ejection chamber and the fluid output hole. The die includes a fluid circulation rib positioned between the fluid input hole and the fluid output hole.
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公开(公告)号:US20210252860A1
公开(公告)日:2021-08-19
申请号:US16958585
申请日:2019-04-29
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Chien-Hua Chen , Michael W Cumbie
Abstract: An example fluidic device may comprise a fluidic die and a support element coupled to the fluidic die. A fluid channel may be arranged within the support element and may define a fluid path through the support element and a fluid aperture of the fluidic die. A conductive element may be arranged in the fluid path and separated from the fluidic die. A conductive lead may provide an electrical coupling between a ground of the fluidic die and the conductive element.
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公开(公告)号:US20210129534A1
公开(公告)日:2021-05-06
申请号:US16629366
申请日:2017-07-31
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Si-lam Choy , Michael W Cumbie , Chien-Hua Chen , Jeffrey R Pollard
Abstract: In one example in accordance with the present disclosure, a fluidic ejection die is described. The die includes an array of nozzles. Each nozzle includes an ejection chamber and an opening. A fluid actuator is disposed within the ejection chamber. The fluidic ejection die also includes an array of passages, formed in a substrate, to deliver fluid to and from the ejection chamber. The fluidic ejection die also includes an array of enclosed cross-channels. Each enclosed cross-channel of the array of enclosed cross-channels is fluidly connected to a respective plurality of passages of the array of passages.
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公开(公告)号:US10532571B2
公开(公告)日:2020-01-14
申请号:US15544999
申请日:2015-03-12
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Zhizhang Chen , James Elmer Abbott, Jr. , Michael W Cumbie , Roberto A Pugliese
Abstract: In one example, a printhead structure includes an ejector element, a multi-layer insulator covering the ejector element, and an amorphous metal on the insulator.
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公开(公告)号:US10076914B2
公开(公告)日:2018-09-18
申请号:US15545013
申请日:2015-02-27
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Chien Hua Chen , Michael W Cumbie , Erik D Torniainen
Abstract: A fluid ejection die has a substrate through which an array of fluid feed holes is formed. The fluid feed holes are separated by ribs. Each fluid feed hole is to guide fluid to an array of drop generators.
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公开(公告)号:US11247470B2
公开(公告)日:2022-02-15
申请号:US16608271
申请日:2018-03-12
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Galen Cook , Garrett E Clark , Michael W Cumbie , James R Przybyla , Richard Seaver , Frank D Derryberry , Si-lam J Choy
Abstract: Examples include a fluid ejection die having a die length and a die width. The fluid ejection die may include a plurality of nozzles arranged along the die length and a die width. The plurality of nozzles is arranged such that at least one pair of neighboring nozzles are positioned at different die width positions along the width of the fluid ejection die. The example fluid ejection die further includes a plurality of ejection chambers including a respective ejection chamber fluidically coupled to each respective nozzle. The fluid ejection die further includes an array of fluid feed holes. The array of fluid feed holes includes a first respective fluid feed hole fluidically coupled to each respective ejection chamber, and the array of fluid feed holes includes a second respective fluid feed hole fluidically coupled to each respective ejection chamber.
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公开(公告)号:US11214065B2
公开(公告)日:2022-01-04
申请号:US16629142
申请日:2017-07-28
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Michael W Cumbie , Chien-Hua Chen
Abstract: A fluid ejection device includes a fluid ejection die including a substrate and a fluid architecture supported by the substrate, and a molded body molded around the fluid ejection die, with the molded body interlocked with the fluid architecture of the fluid ejection die.
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公开(公告)号:US11155086B2
公开(公告)日:2021-10-26
申请号:US16630020
申请日:2017-07-31
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Si-Iam Choy , Michael W Cumbie , Chien-Hua Chen , Jeffrey R Pollard
Abstract: In one example in accordance with the present disclosure, a fluidic ejection device is described. The device includes a fluidic ejection die embedded in a moldable material. The die includes an array of nozzles. Each nozzle includes an ejection chamber and an opening. A fluid actuator is disposed within the ejection chamber. The fluidic ejection die also includes an array of passages, formed in a substrate, to deliver fluid to and from the ejection chamber. The fluidic ejection die also includes an array of enclosed cross-channels. Each enclosed cross-channel of the array of enclosed cross-channels is fluidly connected to a respective plurality of passages of the array of passages. The device also includes the moldable material which includes supply slots to deliver fluid to and from the fluidic ejection die. A carrier substrate of the device supports the fluidic ejection die and moldable material.
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公开(公告)号:US11135839B2
公开(公告)日:2021-10-05
申请号:US16629120
申请日:2017-07-26
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Michael W Cumbie , Anthony Fuller , Chien-Hua Chen , Zhen Yi Li
Abstract: Examples include a fluid die embedded in a molded panel. The fluid die includes a substrate, and the substrate includes a first surface. The molded panel surrounding sides of the fluid die such that the first surface is disposed below a top surface of the molded panel. A raised contact formation is disposed on the substrate to extend at least up to the top surface of the molded panel.
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