Invention Grant
- Patent Title: Heat pump
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Application No.: US14719812Application Date: 2015-05-22
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Publication No.: US10047991B2Publication Date: 2018-08-14
- Inventor: Kidong Kim , Jongchul Ha , Jiwon Chang , Hyunjong Kim
- Applicant: LG ELECTRONICS INC.
- Applicant Address: KR Seoul
- Assignee: LG ELECTRONICS INC.
- Current Assignee: LG ELECTRONICS INC.
- Current Assignee Address: KR Seoul
- Agency: KED & Associates, LLP
- Priority: KR10-2014-0061749 20140522
- Main IPC: F25B1/00
- IPC: F25B1/00 ; F25B49/00 ; F25B49/02 ; F25D21/12 ; F25B6/02 ; F25B30/02 ; F25B7/00 ; F25B13/00 ; F25B47/02

Abstract:
A heat pump includes a first cycle device and a second cycle device. The first cycle device is connected such that, in a heating operation, a first refrigerant is circulated in an order of a first compressor, a 4-way valve, a first heat exchanger, a second heat exchanger, a first expansion mechanism, a third heat exchanger, the 4-way valve, and the first compressor, and such that, in a cooling operation, the first refrigerant is circulated in an order of the first compressor, the 4-way valve, the third heat exchanger, the first expansion mechanism, the second heat exchanger, the first heat exchanger, the 4-way valve, and the first compressor. The second cycle device is connected such that a second refrigerant is circulated in an order of a second compressor, a fourth heat exchanger, a second expansion mechanism, the second heat exchanger, and the second compressor.
Public/Granted literature
- US20150338145A1 HEAT PUMP Public/Granted day:2015-11-26
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