Invention Grant
- Patent Title: Process for manufacturing a MEMS pressure sensor, and corresponding MEMS pressure sensor
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Application No.: US15276617Application Date: 2016-09-26
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Publication No.: US10048148B2Publication Date: 2018-08-14
- Inventor: Lorenzo Baldo , Sarah Zerbini , Enri Duqi
- Applicant: STMICROELECTRONICS S.R.L.
- Applicant Address: IT Agrate Brianza
- Assignee: STMICROELECTRONICS S.R.L.
- Current Assignee: STMICROELECTRONICS S.R.L.
- Current Assignee Address: IT Agrate Brianza
- Agency: Seed Intellectual Property Law Group LLP
- Priority: IT102016000033308 20160331
- Main IPC: G01P15/08
- IPC: G01P15/08 ; H01L21/00 ; G01L9/00 ; B81B3/00 ; B81B7/00 ; B81C1/00

Abstract:
A process for manufacturing a MEMS pressure sensor having a micromechanical structure envisages: providing a wafer having a substrate of semiconductor material and a top surface; forming a buried cavity entirely contained within the substrate and separated from the top surface by a membrane suspended above the buried cavity; forming a fluidic-communication access for fluidic communication of the membrane with an external environment, set at a pressure the value of which has to be determined; forming, suspended above the membrane, a plate region made of conductive material, separated from the membrane by an empty space; and forming electrical-contact elements for electrical connection of the membrane and of the plate region, which are designed to form the plates of a sensing capacitor, the value of capacitance of which is indicative of the value of pressure to be detected. A corresponding MEMS pressure sensor having the micromechanical structure is moreover described.
Public/Granted literature
- US20170284882A1 PROCESS FOR MANUFACTURING A MEMS PRESSURE SENSOR, AND CORRESPONDING MEMS PRESSURE SENSOR Public/Granted day:2017-10-05
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