Manufacturing method for integrated multilayer magnetoresistive sensor

    公开(公告)号:US10353020B2

    公开(公告)日:2019-07-16

    申请号:US15013562

    申请日:2016-02-02

    Abstract: A method of manufacturing a magnetic-field sensor includes forming an insulating layer on a first surface of a substrate. First and second magnetoresistors are formed at different above the first surface of the substrate and are spaced apart from the first surface by different distances. The first and second magnetoresistors have respective main axes of magnetization transverse to one another, and respective secondary axes of magnetization transverse to one another. The method further includes forming a first magnetic-field generator configured to generate a first magnetic field having field lines along the main axis of magnetization of the first magnetoresistor, and forming a second magnetic-field generator configured to generate a second magnetic field having field lines along the main axis of magnetization of the second magnetoresistor.

    Integrated triaxial magnetometer of semiconductor material manufactured in MEMS technology
    2.
    发明授权
    Integrated triaxial magnetometer of semiconductor material manufactured in MEMS technology 有权
    用MEMS技术制造的半导体材料的集成三轴磁力计

    公开(公告)号:US08760156B2

    公开(公告)日:2014-06-24

    申请号:US13905006

    申请日:2013-05-29

    CPC classification number: G01R33/0286 G01R33/0005 G01R33/028 G01R33/038

    Abstract: Two suspended masses are configured so as to be flowed by respective currents flowing in the magnetometer plane in mutually transversal directions and are capacitively coupled to lower electrodes. Mobile sensing electrodes are carried by the first suspended mass and are capacitively coupled to respective fixed sensing electrodes. The first suspended mass is configured so as to be mobile in a direction transversal to the plane in presence of a magnetic field having a component in a first horizontal direction. The second suspended mass is configured so as to be mobile in a direction transversal to the plane in presence of a magnetic field having a component in a second horizontal direction, and the first suspended mass is configured so as to be mobile in a direction parallel to the plane and transversal to the current flowing in the first suspended mass in presence of a magnetic field having a component in a vertical direction.

    Abstract translation: 两个悬挂质量被配置为使得在相互横向上在磁力计平面中流动的相应电流流动,并且电容耦合到下电极。 移动感测电极由第一悬浮质量携带并且电容耦合到相应的固定感测电极。 第一悬挂质量被配置为在存在具有在第一水平方向上的分量的磁场的情况下在横向于平面的方向上是可移动的。 第二悬挂质量被配置为在存在具有在第二水平方向上的分量的磁场的情况下在横向于平面的方向上是可移动的,并且第一悬挂质量被配置为在平行于 并且在存在具有在垂直方向上的分量的磁场的情况下横向于在第一悬浮质量块中流动的电流。

    Process for manufacturing a MEMS pressure sensor, and corresponding MEMS pressure sensor

    公开(公告)号:US10048148B2

    公开(公告)日:2018-08-14

    申请号:US15276617

    申请日:2016-09-26

    Abstract: A process for manufacturing a MEMS pressure sensor having a micromechanical structure envisages: providing a wafer having a substrate of semiconductor material and a top surface; forming a buried cavity entirely contained within the substrate and separated from the top surface by a membrane suspended above the buried cavity; forming a fluidic-communication access for fluidic communication of the membrane with an external environment, set at a pressure the value of which has to be determined; forming, suspended above the membrane, a plate region made of conductive material, separated from the membrane by an empty space; and forming electrical-contact elements for electrical connection of the membrane and of the plate region, which are designed to form the plates of a sensing capacitor, the value of capacitance of which is indicative of the value of pressure to be detected. A corresponding MEMS pressure sensor having the micromechanical structure is moreover described.

    Integrated multilayer magnetoresistive sensor and manufacturing method thereof
    4.
    发明授权
    Integrated multilayer magnetoresistive sensor and manufacturing method thereof 有权
    集成多层磁阻传感器及其制造方法

    公开(公告)号:US09423474B2

    公开(公告)日:2016-08-23

    申请号:US13929635

    申请日:2013-06-27

    CPC classification number: G01R33/096 G01R33/0017 G01R33/0052 G01R33/0206

    Abstract: A magnetic-field sensor includes: a chip including a substrate having a first surface and an insulating layer covering the first surface; first and second magnetoresistors each extending into the insulating layer and having a main axis of magnetization and a secondary axis of magnetization; a first magnetic-field generator configured to generate a first magnetic field having field lines along the main axis of magnetization of the first magnetoresistor; a second magnetic-field generator configured to generate a second magnetic field having field lines along the main axis of magnetization of the second magnetoresistor. The main axes of magnetization extending transversely to each other and the secondary axes of magnetization extending transversely to each other. The first and second magnetoresistors extend into the insulating layer at a first distance and a second distance, respectively, that differ from one another, from the first surface.

    Abstract translation: 磁场传感器包括:芯片,其包括具有覆盖第一表面的第一表面和绝缘层的基板; 第一和第二磁阻器各自延伸到绝缘层中并且具有主轴的磁化和次级磁化轴; 第一磁场发生器,被配置为产生具有沿着所述第一磁电阻的主磁化轴的场线的第一磁场; 第二磁场发生器被配置为产生具有沿着第二磁阻的主磁化轴的场线的第二磁场。 磁化的主轴线彼此横向延伸,磁化的副轴相互横向延伸。 第一和第二磁阻器分别从第一表面延伸到彼此不同的第一距离和第二距离处的绝缘层。

    INTEGRATED MULTILAYER MAGNETORESISTIVE SENSOR AND MANUFACTURING METHOD THEREOF
    5.
    发明申请
    INTEGRATED MULTILAYER MAGNETORESISTIVE SENSOR AND MANUFACTURING METHOD THEREOF 审中-公开
    集成多层磁阻传感器及其制造方法

    公开(公告)号:US20160154067A1

    公开(公告)日:2016-06-02

    申请号:US15013562

    申请日:2016-02-02

    Abstract: A magnetic-field sensor includes: a chip including a substrate having a first surface and an insulating layer covering the first surface; first and second magnetoresistors each extending into the insulating layer and having a main axis of magnetization and a secondary axis of magnetization; a first magnetic-field generator configured to generate a first magnetic field having field lines along the main axis of magnetization of the first magnetoresistor; a second magnetic-field generator configured to generate a second magnetic field having field lines along the main axis of magnetization of the second magnetoresistor. The main axes of magnetization extending transversely to each other and the secondary axes of magnetization extending transversely to each other. The first and second magnetoresistors extend into the insulating layer at a first distance and a second distance, respectively, that differ from one another, from the first surface.

    Abstract translation: 磁场传感器包括:芯片,其包括具有覆盖第一表面的第一表面和绝缘层的基板; 第一和第二磁阻器各自延伸到绝缘层中并且具有主轴的磁化和次级磁化轴; 第一磁场发生器,被配置为产生具有沿着所述第一磁电阻的主磁化轴的场线的第一磁场; 第二磁场发生器被配置为产生具有沿着第二磁阻的主磁化轴的场线的第二磁场。 磁化的主轴线彼此横向延伸,磁化的副轴相互横向延伸。 第一和第二磁阻器分别从第一表面延伸到彼此不同的第一距离和第二距离处的绝缘层。

    TEMPERATURE-COMPENSATED MICRO-ELECTROMECHANICAL DEVICE, AND METHOD OF TEMPERATURE COMPENSATION IN A MICRO-ELECTROMECHANICAL DEVICE
    6.
    发明申请
    TEMPERATURE-COMPENSATED MICRO-ELECTROMECHANICAL DEVICE, AND METHOD OF TEMPERATURE COMPENSATION IN A MICRO-ELECTROMECHANICAL DEVICE 审中-公开
    温度补偿型微电化学装置及微机电装置中的温度补偿方法

    公开(公告)号:US20150284243A1

    公开(公告)日:2015-10-08

    申请号:US14271009

    申请日:2014-05-06

    Abstract: A micro-electromechanical device includes a semiconductor substrate, in which a first microstructure and a second microstructure of reference are integrated. The first microstructure and the second microstructure are arranged in the substrate so as to undergo equal strains as a result of thermal expansions of the substrate. Furthermore, the first microstructure is provided with movable parts and fixed parts with respect to the substrate, while the second microstructure has a shape that is substantially symmetrical to the first microstructure but is fixed with respect to the substrate. By subtracting the changes in electrical characteristics of the second microstructure from those of the first, variations in electrical characteristics of the first microstructure caused by changes in thermal expansion or contraction can be compensated for.

    Abstract translation: 微机电装置包括半导体衬底,其中第一微结构和第二参考微结构被集成。 第一微结构和第二微结构被布置在基板中,以便由于基板的热膨胀而产生相等的应变。 此外,第一微结构相对于基板设置有可移动部件和固定部件,而第二微结构具有与第一微结构基本对称的形状,但是相对于基板固定。 通过从第一微结构的电特性减去第一微结构的电特性的变化,可以补偿由热膨胀或收缩的变化引起的第一微结构的电特性的变化。

    Microelectromechanical sensor with improved mechanical decoupling of sensing and driving modes
    8.
    再颁专利
    Microelectromechanical sensor with improved mechanical decoupling of sensing and driving modes 有权
    微机电传感器具有改进的感测和驱动模式的机械去耦

    公开(公告)号:USRE45855E1

    公开(公告)日:2016-01-19

    申请号:US14062671

    申请日:2013-10-24

    Abstract: A driving mass of an integrated microelectromechanical structure is moved with a rotary motion about an axis of rotation, and a sensing mass is connected to the driving mass via elastic supporting elements so as to perform a detection movement in the presence of an external stress. The driving mass is anchored to a first anchorage arranged along the axis of rotation by first elastic anchorage elements. The driving mass is also coupled to a pair of further anchorages positioned externally thereof and coupled to opposite sides with respect to the first anchorage by further elastic anchorage elements; the elastic supporting elements and the first and further elastic anchorage elements render the driving mass fixed to the first sensing mass in the rotary motion, and substantially decoupled from the sensing mass in the detection movement, the detection movement being a rotation about an axis lying in a plane.

    Abstract translation: 集成微电子机械结构的驱动质量以围绕旋转轴线的旋转运动移动,并且感测质量块经由弹性支撑元件连接到驱动质量块,以便在存在外部应力的情况下执行检测运动。 驱动质量块被锚固到通过第一弹性锚固元件沿着旋转轴线布置的第一锚固件。 驱动质量体还连接到位于其外部的一对另外的锚固件,并且通过另外的弹性锚定元件相对于第一锚固件相对于相对侧联接; 弹性支撑元件和第一和另外的弹性锚固元件使得驱动质量在旋转运动中固定到第一感测块,并且在检测运动中基本上与感测质量分离,检测运动是围绕位于 一架飞机。

    INTEGRATED ACOUSTIC TRANSDUCER IN MEMS TECHNOLOGY, AND MANUFACTURING PROCESS THEREOF
    9.
    发明申请
    INTEGRATED ACOUSTIC TRANSDUCER IN MEMS TECHNOLOGY, AND MANUFACTURING PROCESS THEREOF 审中-公开
    MEMS技术中的集成式声学传感器及其制造工艺

    公开(公告)号:US20140038335A1

    公开(公告)日:2014-02-06

    申请号:US14035798

    申请日:2013-09-24

    Abstract: A MEMS acoustic transducer, for example, a microphone, includes a substrate provided with a cavity, a supporting structure, fixed to the substrate, a membrane having a perimetral edge and a centroid, suspended above the cavity and fixed to the substrate the membrane configured to oscillate via the supporting structure. The supporting structure includes a plurality of anchorage elements fixed to the membrane, and each anchorage element is coupled to a respective portion of the membrane between the centroid and the perimetral edge of the membrane.

    Abstract translation: MEMS声换能器,例如麦克风,包括设置有空腔的基板,固定到基板的支撑结构,具有周缘和质心的膜,悬挂在空腔上方并固定到基板上,膜构造 通过支撑结构振荡。 支撑结构包括固定在膜上的多个锚定元件,并且每个锚定元件在膜的质心和周边之间连接到膜的相应部分。

    Process for manufacturing a MEMS pressure sensor, and corresponding MEMS pressure sensor

    公开(公告)号:US10578505B2

    公开(公告)日:2020-03-03

    申请号:US15958461

    申请日:2018-04-20

    Abstract: A process for manufacturing a MEMS pressure sensor having a micromechanical structure envisages: providing a wafer having a substrate of semiconductor material and a top surface; forming a buried cavity entirely contained within the substrate and separated from the top surface by a membrane suspended above the buried cavity; forming a fluidic-communication access for fluidic communication of the membrane with an external environment, set at a pressure the value of which has to be determined; forming, suspended above the membrane, a plate made of polysilicon, separated from the membrane by an empty space; and forming electrical-contact elements for electrical connection of the membrane and of the plate, which are designed to form the plates of a sensing capacitor, the value of capacitance of which is indicative of the value of pressure to be detected. A corresponding MEMS pressure sensor having the micromechanical structure is moreover described.

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