- Patent Title: Conductive alignment layer, manufacture method of the conductive alignment layer, display substrate comprising the conductive alignment layer, and display device
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Application No.: US14437132Application Date: 2014-10-14
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Publication No.: US10048540B2Publication Date: 2018-08-14
- Inventor: Wenbo Li , Chunyan Ji
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Ladas & Parry LLP
- Agent Loren K. Thompson
- Priority: CN201310741661 20131227
- International Application: PCT/CN2014/088584 WO 20141014
- International Announcement: WO2015/096537 WO 20150702
- Main IPC: G02F1/1337
- IPC: G02F1/1337 ; C09K19/56 ; G02F1/1335 ; H05K3/10 ; G03F1/00 ; G03F1/42 ; H05K3/12

Abstract:
Disclosed are a conductive alignment layer, a manufacture method of the conductive alignment layer, a display substrate comprising the conductive alignment layer and a display device which relate to the technology of LCD, simplify the manufacture method of conductive layer and alignment layer and also reduce the complexity in manufacturing a LCD device by preparing the conductive layer and the alignment layer in the substrate simultaneously through utilizing a material possessing both conductivity and alignment, without the need of preparing the conductive layer and the alignment layer separately.
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