Invention Grant
- Patent Title: Chip package and method for forming the same
-
Application No.: US15483928Application Date: 2017-04-10
-
Publication No.: US10050006B2Publication Date: 2018-08-14
- Inventor: Chia-Lun Shen , Yi-Ming Chang , Tsang-Yu Liu , Yen-Shih Ho
- Applicant: XINTEC INC.
- Applicant Address: TW Taoyuan
- Assignee: XINTEC INC.
- Current Assignee: XINTEC INC.
- Current Assignee Address: TW Taoyuan
- Agency: Liu & Liu
- Priority: TW103111918A 20140331; TW104106789A 20150304
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/48 ; H01L23/52 ; H01L21/78
Abstract:
A method for forming a chip package is provided. The method includes providing a first substrate and a second substrate. The first substrate is attached onto the second substrate by an adhesive layer. A first opening is formed to penetrate the first substrate and the adhesive layer and separate the first substrate and the adhesive layer into portions. A chip package formed by the method is also provided.
Public/Granted literature
- US20170213805A1 CHIP PACKAGE AND METHOD FOR FORMING THE SAME Public/Granted day:2017-07-27
Information query
IPC分类:
