Invention Grant
- Patent Title: Communication jack having a dielectric film between plug interface contacts
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Application No.: US15469903Application Date: 2017-03-27
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Publication No.: US10050384B2Publication Date: 2018-08-14
- Inventor: Satish I. Patel , Roman J. Churnovic , Jean De Dieu Mutangana
- Applicant: Panduit Corp.
- Applicant Address: US IL Tinley Park
- Assignee: Panduit Corp.
- Current Assignee: Panduit Corp.
- Current Assignee Address: US IL Tinley Park
- Agent Christopher S. Clancy; James H. Williams; Christopher K. Marlow
- Main IPC: H01R13/6464
- IPC: H01R13/6464 ; H01R24/64 ; H01R13/6461

Abstract:
Embodiments of the present invention relate to designs for network jacks which can be used for cable connectivity. In an embodiment, the present invention is an RJ45 jack that utilizes a thin dielectric film between two layers of PICs that provide crosstalk compensation by way of their geometry. Compensation is achieved by way of capacitor plates which sandwich a thin dielectric film. This allows for the layers of PICs to be in close proximity and achieve higher coupling where desired, allowing a greater amount of compensation to occur close to the plug/jack contact point. This can have the effect of moving compensation closer to the plug/jack contact point, which in turn may reduce the amount of compensation needed further along the data path.
Public/Granted literature
- US20170302029A1 COMMUNICATION JACK HAVING A DIELECTRIC FILM BETWEEN PLUG INTERFACE CONTACTS Public/Granted day:2017-10-19
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